PRODUCTS

The physical properties of the product allow its use in applications requiring resistance to creep and stress relaxation, maintenance of mechanical properties at high ambient temperatures, and high-load bearing strength. Exceptional substrate wetting and water displacement properties ensure excellent adhesion under adverse application conditions, e.g., cold, wet concrete. The working life/cure time of Kemko 008 LP Bonder may be decreased, if required, by pre-blending Part B with Part B of the short pot life liquid product, Kemko^® 008 SP Bonder. Blending the mixed product with a mixed companion paste product, Kemko^® 009 SP Paste, will increase the viscosity of Kemko^® 008 SP Bonder. The long and short pot life and bonder and paste forms of the product (Kemko^® 001, 008, 009, and 028) employ a 2:1 (by vol.) mixing ratio that must be maintained at all times.